LVD電纜組件的功能和應用

LVDS cable assemblies are designed for high-speed, 低功率數據傳輸, 主要用於需要快速數據傳輸和受控環境的應用. 這些組件有助於各種設備之間的通信, 包括顯示面板, 信息娛樂系統, 和工業自動化設備. 它們通過支持更高的數據速率提供了比傳統電纜的優勢, 較長的電纜長度, 和改善的噪聲免疫力.

中國定制的JAE連接器LVD數據電纜

Micro Coaxial Cable Assemblies Jae fi-r Connectors

i-pex cable assembly manufacturers

Functions and applications of LVDS cable assemblies
我. Functional characteristics
‌Differential signal transmission‌
Adopting a low voltage (about 350mV) differential pair structure, data is transmitted through two lines with opposite polarities, effectively suppressing common mode noise and electromagnetic interference, and improving signal integrity.

‌Low power consumption and low electromagnetic radiation‌
The constant current source drive mode (typical current 3.5mA) combined with CMOS technology significantly reduces static power consumption (about 1.225mW), and the electromagnetic radiation intensity is only 1/10 of that of traditional TTL/CMOS.

Here’s a more detailed look at the functions and applications:
功能:
High-Speed Data Transmission:
LVDS cables excel at transferring large amounts of data quickly, crucial for applications like high-resolution displays and real-time video feeds.
Low Power Consumption:
LVDS technology is designed to minimize power draw, making it suitable for battery-powered devices and applications where power efficiency is critical.
Long Cable Lengths:
LVDS can transmit data over longer distances compared to some other technologies, enabling wider placement of components in various systems.
Noise Immunity:
The differential signaling in LVDS helps to reduce noise interference, ensuring reliable data transfer even in noisy environments.
Organization and Efficiency:
Cable assemblies help organize multiple wires into a single, manageable package, reducing the risk of tangled wires.
Protection:
Assemblies protect wires from environmental factors such as moisture, heat, 磨損, and chemicals.

‌High-speed data transmission capability‌
The theoretical limit rate is 1.923Gbps, supporting high-speed interface requirements such as HDMI and DisplayPort, and is widely used in video streaming, automotive ADAS and other scenarios.

‌Strong environmental adaptability‌
Supports a wide temperature range (-40℃～125℃), is vibration-resistant and corrosion-resistant, and meets the connection requirements of harsh working conditions such as automotive electronics and industrial equipment.

‌Flexible termination design‌
The receiving end achieves impedance matching through a 100Ω parallel resistor, which simplifies system design and enhances timing accuracy, and is suitable for backplane communication and long-distance transmission.

LVDS Cable Assembly with 40 Ohm DF13-DF14 Connectors

OEM / ODM LVDS Ribbon Micro Coaxial Cable Assemblies

中國LVD連接有線電視供應商

ii. 應用程序方案
‌Display technology‌
Connects the LCD panel and the drive circuit to transmit high-resolution video signals, ensures image clarity and real-time performance, and is used in scenarios such as LCD TVs and vehicle dashboards.

‌Automotive electronics‌
Used for vehicle display screens, reversing images and ADAS systems to meet high-speed camera data transmission and automotive-grade vibration and temperature resistance requirements.

‌Communication equipment‌
As a data transmission channel for 5G base stations and routers, it supports stable transmission of high-frequency signals and reduces communication delays and bit error rates7.

‌Industrial automation‌
Replaces traditional parallel buses in backplane design, reduces PCB wiring complexity, and improves the reliability of PLC and industrial robot control systems.

‌Medical and aerospace‌
Suitable for high-sensitivity signal transmission of medical imaging equipment, as well as radiation-resistant and high-temperature-resistant data links inside spacecraft.

Technology Evolution Direction
With the development of in-vehicle smart cockpits and industrial Internet of Things, LVDS cable assemblies will further integrate flexible circuit technology to support higher bandwidth (such as 10Gbps+) and modular design to meet the miniaturization and high-density integration requirements of the next generation of smart devices.